Avionics
Three boards. 33 grams.
Flight controller, GPS module, and airspeed sensor. MIL STD 810H and MIL STD 461G certified. Contact us for full datasheets.
Flight Controller
10g · 40 × 40 mm
- Cortex M7 @ 480 MHz
- 3× ICM 42688 P IMU
- 2× DPS368 Barometer
- 1W integrated heater
- 5.5V to 54V direct input
- 14 PWM / DSHOT outputs
- Dual CAN FD
GPS Module
20g · 40 × 40 mm
- u blox F10 L1/L5 receiver
- 5 GNSS constellations
- Onboard dual band antenna
- Anti spoof / Anti jam
- RTK multi constellation
- RM3100 + IST8310 mag
- Independent IMU + baro
Airspeed Sensor
3g · 25 × 25 mm
- ±250 km/h range
- Differential + absolute
- 75 kPa burst pressure
- Temp comp: −40°C to +75°C
- CAN daisy chain
- 30 mA max power
Nano coated as standard
Locking connectors
No carrier board
No external power module
Cross board redundancy
IP67 potting available
ArduPilot compatible
Competitive Comparison
How we compare
ES Avionics Suite vs the industry standard.
| Feature | Elliptic | Company A | Company B |
|---|
Special Projects
Custom solutions.
We work with defence primes, integrators, and operators on tailored avionics and systems solutions, from modified hardware to full custom builds.
Custom Hardware Design
Modified variants of our standard stack or fully bespoke designs. All work to MIL STD standards.
System Integration
Electrical, mechanical, and firmware support for integrating our avionics into your platform.
Classified Programmes
Secure handling of technical data and deliverables.
Low Volume Production
10 units or 1,000. Short lead times, consistent quality.
Contract Manufacturing
Contract Electronics Manufacturing
UK based electronics manufacturing. Same facility, team, and standards as our mil spec avionics. EU/US supply chain.
Capabilities
SMT Assembly
Down to 01005. BGA, QFN, fine pitch. Lead free RoHS compliant.
Conformal Coating & Potting
Nano coating, fully waterproof, no masking or potting to IP67.
Test & Inspection
3D AOI and functional test. Full reports provided.
Firmware Programming
Automated programming jigs for complex firmware deployments.
Laser Depanelling & Masking
Laser panel separation, no board damage. Component masking.
Box Build
Complete product assembly, wiring, labelling, packaging.
Component Traceability
Full traceability from paste printing to finished product.
Large Scale & Prototype
We cater for all production run sizes.
Process
01Send us your Gerbers, BOM, and assembly notes.
02We source all components from EU/US distributors.
03Assembly, test, and coating in our Hereford facility.
04Delivered with full test reports and traceability documentation.